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List of Figures
Chapter 3: Optimizing Hard Drives
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Fig. 3.1. How to run ScanDisk
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Fig. 3.2. A dialog box in the ScanDisk program
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Fig. 3.3. How to run Disk Defragmenter
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Fig. 3.4. Choosing the logical drive to defragment
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Fig. 3.5. The defragmentation process of the chosen disk
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Fig. 3.6. Dialog box upon completion of defragmentation
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Fig. 3.7. Selecting the Properties command from the right-click menu
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Fig. 3.8. To check the selected disk for errors, click the Check Now button
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Fig. 3.9. Disk scanning in progress (Windows 2000)
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Fig. 3.10. Disk scanning in progress (Windows XP)
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Fig. 3.11. Starting Norton Speed Disk 5.1
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Fig. 3.12. Data on the fragmentation provided by Norton Speed Disk 5.1
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Fig. 3.13. Defragmenting NTFS-formatted disk using O&O Defrag 1.21
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Fig. 3.14. Starting the Windows 2000 built-in defragmentation utility
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Fig. 3.15. Starting the Windows XP built-in defragmentation utility
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Fig. 3.16. The Disk Defragmenter window (Windows 2000)
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Fig. 3.17. Defragmenting the selected partition
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Fig. 3.18. Defragmentation in progress (Windows 2000)
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Fig. 3.19. Defragmentation in progress (Windows XP)
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Fig. 3.20. Information appearing after Running ScanDisk
Chapter 4: Compressing the Hard Drive
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Fig. 4.1. DriveSpace 3 startup window
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Fig. 4.2. The compression properties of the selected drive
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Fig. 4.3. Prognosis on the drive's compression
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Fig. 4.4. The Create Startup Disk window
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Fig. 4.5. Before actually compressing the drive, the DriveSpace program requests a confirmation
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Fig. 4.6. The compression procedure in progress
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Fig. 4.7. Information on the compression results
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Fig. 4.8. Compression properties of the selected drive
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Fig. 4.9. The Disk Compression Settings dialog box
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Fig. 4.10. Running the Compression Agent program
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Fig. 4.11. Setting the compression parameters
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Fig. 4.12. The results of using the Compression Agent program
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Fig. 4.13. The Folder Options command from the Tools menu
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Fig. 4.14. The View tab in the Folder Options window
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Fig. 4.15. To enable visual control over compressed and uncompressed files and folders, set the Display compressed files and folders with alternate color checkbox
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Fig. 4.16. Selecting the Properties command from the right-click menu
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Fig. 4.17. The Properties window
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Fig. 4.18. The Advanced Attributes window
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Fig. 4.19. Setting the compression attribute
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Fig. 4.20. The Properties window displaying the properties of compressed files and folders
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Fig. 4.21. The Confirm Attribute Changes window prompts you to apply the attribute change to the selected folder only or to the selected folder and all its contents (subfolders and files)
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Fig. 4.22. The Applying Attributes window
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Fig. 4.23. Compressing the whole partition or logical disk
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Fig. 4.24. The compressed folder properties
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Fig. 4.25. The uncompressed folder properties
Chapter 6: Optimizing the Video Subsystem
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Fig. 6.1. Setting the resolution and palette in Windows 95
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Fig. 6.2. Settings for maximum operating speed in Windows 95 (Display)
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Fig. 6.3. Settings for maximum operating speed in Windows 95 (System)
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Fig. 8.1. Entering the name of the file that contains the new BIOS program code
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Fig. 8.2. BIOS flashing in progress
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Fig. 8.3. Test results for computers with different BIOS versions
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Fig. 8.4. Test results for computers with different BIOS versions
Chapter 9: Testing, Monitoring, and Diagnostics
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Fig. 9.1. Display of data on the configuration and choice of tests in the SysInfo program
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Fig. 9.2. Testing with the SysInfo program
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Fig. 9.3. Testing with the CheckIt 3.0 program
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Fig. 9.4. Testing with the PC-CONFIG program
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Fig. 9.5. The WinBench 99 program
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Fig. 9.6. Choice of tests in WinBench 99
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Fig. 9.7. An example of testing the processor with the WinBench 99 program
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Fig. 9.8. The WinCheckIt program
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Fig. 9.9. Power Management tools in BIOS Setup
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Fig. 9.10. Monitoring two items
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Fig. 9.11. Adding items in the System monitoring program
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Fig. 9.12. Monitoring four items
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Fig. 9.13. An example of device diagnostics
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Fig. 9.14. Running the REGEDIT program
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Fig. 9.15. The registry editor program
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Fig. 9.16. A scheme for PC hardware monitoring
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Fig. 9.17. Schemes for connecting semiconductor temperature sensors to the W83782D chip (a — 2N3904 transistor, b — built-in thermal diode of the Pentium III processor)
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Fig. 9.18. External temperature sensor for Slot 1 processors
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Fig. 9.19. External temperature sensor set within Socket A
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Fig. 9.20. Monitoring capabilities are often built-in to the BIOS Setup routine
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Fig. 9.21. The Winbond Hardware Doctor Ver 2.10 program
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Fig. 9.22. Setting upper and lower limits
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Fig. 9.23. Upper temperature limit
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Fig. 9.24. Lower fan rotation speed limit
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Fig. 9.25. The warning message
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Fig. 9.26. The MBM program
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Fig. 9.27. A window in the MBM program with modified values
Chapter 10: Windows 9x/NT/2000 Local Area Networks
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Fig. 10.1. Coaxial cable and BNC connector
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Fig. 10.2. T-connector and terminator (50 ohms)
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Fig. 10.3. Connecting the coaxial cable to the network adapter via a T-connector
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Fig. 10.4. Connecting the PC to the LAN
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Fig. 10.5. Connecting cable pieces using a BNC barrel connector
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Fig. 10.6. RJ-45 connector with the twisted pair cable
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Fig. 10.7. Connecting the RJ-45 connector to the network adapter
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Fig. 10.8. Onstalling the network cards
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Fig. 10.9. Installing the network configuration
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Fig. 10.10. Organizing access to a logical disk
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Fig. 10.11. Setting up access to a logical disk
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Fig. 10.12. Sharing a folder
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Fig. 10.13. Specifying access type to a folder
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Fig. 10.14. Mapping the network drive
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Fig. 10.15. Creating a remote access server
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Fig. 10.16. Window for setting up access to network resources for remote users
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Fig. 10.17. Starting the Users applet in the Control Panel window (Windows 98)
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Fig. 10.18. The Enable Multi-user Settings window
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Fig. 10.19. The Add User window
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Fig. 10.20. The Enter New Password window
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Fig. 10.21. The Personalized Items Settings window
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Fig. 10.22. The Enable Multi-user Settings window
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Fig. 10.23. Starting the Users and Passwords applet from the Control Panel window
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Fig. 10.24. The Users and Passwords window
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Fig. 10.25. The Add New User window. Entering the user name
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Fig. 10.26. The Add New User window. Entering the password
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Fig. 10.27. The Users and Passwords window displays the list of users, including the newly created user
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Fig. 10.28. Selecting the Properties command from My Network Places right-click menu
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Fig. 10.29. The Network and Dial-up Connections window
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Fig. 10.30. Selecting the Properties command from the Local Area Connection right-click menu
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Fig. 10.31. The Local Area Connection Properties window
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Fig. 10.32. Selecting the Protocol option in the Select Network Component Type window
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Fig. 10.33. Selecting the protocol to be installed
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Fig. 10.34. The Local Area Connection Properties window contains the newly installed NetBEUI Protocol in the list of detected network components
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Fig. 10.35. The Local Area Connection Properties window with the list of all installed network components
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Fig. 10.36. The Network Identification tab of the System Properties window
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Fig. 10.37. Renaming the computer and joining another workgroup in the Identification Changes window
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Fig. 10.38. The Network Identification tab of the System Properties window now contains new names
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Fig. 10.39. Selecting the Map Network Drive command (Windows 2000)
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Fig. 10.40. Mapping the shared network resource (Windows 2000)
Chapter 14: Overclocking Video Adapters and Hard Drives
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Fig. 14.1. Test results from 3d WinBench 98/3D Processing
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Fig. 14.2. Test results from 3D WinBench 98/3D Scene
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Fig. 14.3. Test results from 3D WinBench 98/3D WinMark
Chapter 17: Motherboards and Chipsets for Overclocking Modes
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Fig. 17.1. Structure and
basic elements of Abit BE6-II motherboards
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Fig. 17.2. Heatsink and fan
installed on the North Bridge chip
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Fig. 17.3. The structure
and basic elements of the ASUS P3B-F motherboard
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Fig. 17.4. The ASUS P3B-F
motherboard
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Fig. 17.5. The structure
and basic elements of the CT-6ATA2
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Fig. 17.6. The structure
and basic elements of the CT-6ATA4
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Fig. 17.7. Structure of a
computer with the i440BX AGPset chipset
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Fig. 17.8. UltraDMA/66
controller (HighPoint HPT 366) in the architecture of a computer with the
i440BX AGP set chipset
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Fig. 17.9. The Super I/O
controller (Winbond W83977EF) and hardware monitoring (W83782D) in the
architecture of computers with the i440BX AGPset chipset
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Fig. 17.10. The structure
of a computer with the VIA Apollo Pro 133A chipset
Chapter 18: Cooling Devices and Methods
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Fig. 18.1. An example of a heatsink for a processor
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Fig. 18.2. An example of a fan for a processor
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Fig. 18.3. An example of a processor's cooler
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Fig. 18.4. The external view of a cooler from Sanyo
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Fig. 18.5. The Intel cooler recommended for the Pentium III 700 processor
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Fig. 18.6. The TTC-D2T cooler from Titan recommended for AMD Duron and AMD Athlon (Thunderbird) processors
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Fig. 18.7. The Chrome Orb cooler from Thermaltake
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Fig. 18.8. Example of a cooler for Pentium II/III
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Fig. 18.9. Recommended Coolers for Certain Processors
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Fig. 18.10. Experimental arrangement for measuring Peltier heat (Cu — copper, Bi — bismuth)
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Fig. 18.11. Release of Peltier heat at the contact of n- and p- type semiconductors
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Fig. 18.12. Absorption of Peltier heat at the contact of n- and p-type semiconductors
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Fig. 18.13. Usage of p- and n-semiconductors in thermoelectric refrigerators
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Fig. 18.14. The structure of a Peltier module
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Fig. 18.15. External view of a typical Peltier module
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Fig. 18.16. Cascaded Peltier modules
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Fig. 18.17. An external view of a cooler with a Peltier module
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Fig. 18.18. External view of the PAP2X3B cooler
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Fig. 18.19. Dialog box of the CpuIdle program
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Fig. 18.20. Working process of the CpuIdle program
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Fig. 18.21. Temperature values without using the software
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Fig. 18.22. Temperature values when using the software
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Fig. 18.23. Setting up the working parameters of CpuIdle
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Fig. 18.24. CPUmark 99 test results
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Fig. 18.25. Setting the indicator parameters for the CpuIdle program
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Fig. 18.26. Setting the temperature control parameters
Chapter 19: Examples and Results of Overclocking
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Fig. 19.1. Processor test results
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Fig. 19.2. Co-processor test results
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Fig. 19.3. Hard drive test results
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Fig. 19.4. Video system test results
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Fig. 19.5. Results of testing a computer with an AMD Am5×86-133 processor
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Fig. 19.6. Results of testing a computer with an AMD Am5x86-133 processor
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Fig. 19.7. Growth in performance from the data given by the WinCheckIt test program (v2.03)
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Fig. 19.8. Growth in performance from the data given by the Xing test (v3.0)
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Fig. 19.9. CPUmark99 test results
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Fig. 19.10. FPU WinMark test results
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Fig. 19.11. HDD/Bus test results
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Fig. 19.12. HDD/HE test results
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Fig. 19.13. Disk Access Time test results
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Fig. 19.14. Disk Transfer Rate test results
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Fig. 19.15. 3D Mark test results
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Fig. 19.16. CPU 3Dmark test results
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Fig. 19.17. Winstone test results
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Fig. 19.18. CPU Mark32 test results
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Fig. 19.19. FPU Mark test results
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Fig. 19.20. Quake2 test results
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Fig. 19.21. Winstone test results
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Fig. 19.22. CPU Mark32 test results
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Fig. 19.23. FPU Mark test results
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Fig. 19.24. Test results from Quake2, FPS
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Fig. 19.25. Unreal test results, FPS
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Fig. 19.26. CPU Mark99 test results
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Fig. 19.27. FPU Mark test results
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Fig. 19.28. HDD/Bus test results
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Fig. 19.29. HDD/HE test results
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Fig. 19.30. CPU test results
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Fig. 19.31. FPU test results
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Fig. 19.32. CPUMark99 test results
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Fig. 19.33. FPUMark test results
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Fig. 19.34. Quake test results
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Fig. 19.35. Quake2 test results
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Fig. 19.36. Performance of the processor
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Fig. 19.37. Performance of the hard drive
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Fig. 19.38. Disk/Playback/HE test results
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Fig. 19.39. CPUMark 32 test results
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Fig. 19.40. FPUMark test results
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Fig. 19.41. CPUMark99 test results
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Fig. 19.42. SI Norton Utilities 4.0 test results
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Fig. 19.43. Quake 2 test results
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Fig. 19.44. Items on the BIOS Setup's SoftMenu III Setup menu
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Fig. 19.45. Setting the recommended parameters in SoftMenu III Setup
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Fig. 19.46. An example of setting the overclocking parameters in SoftMenu III Setup
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Fig. 19.47. Test results
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Fig. 19.48. Test results
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Fig. 19.49. Items on the BIOS Setup SoftMenu III Setup menu
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Fig. 19.50. Setting the recommended parameters in SoftMenu III Setup
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Fig. 19.51. An example of setting the overclocking parameters in SoftMenu III Setup
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Fig. 19.52. Test results
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Fig. 19.53. Test results
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Fig. 19.54. An example of setting the overclocking parameters in SoftMenu III Setup
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Fig. 19.55. Test results
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Fig. 19.56. Test results
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Fig. 19.57. SiSoft Sandra CPU test results
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Fig. 19.58. CPUmark 99 test results
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Fig. 19.59. 3D Mark 2000 test results
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Fig. 19.60. Quake 3 test results
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Fig. 19.61. Content Creation Winstone 2000 test results
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Fig. 19.62. SYSmark 2000 test results
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Fig. 19.63. Quake3 (1024 ×768 ×32) test results
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Fig. 19.64. Quake3 (640 ×480 ×16) test results
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Fig. 19.65. Unreal Tournament (1024x768x32) test results
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Fig. 19.66. The Business Winstone 2001 test results
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Fig. 19.67. The SYSmark 2000 test results
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Fig. 19.68. The 3Dmark 2001 test results
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Fig. 19.69. Quake3 1.09, demo2-fastest test results for the AMD Athlon 650
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Fig. 19.70. The tested AMD Athlon (Thunderbird) processor
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Fig. 19.71. The Abit KT7 motherboard
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Fig. 19.72. The Titan TTC-D2T cooler
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Fig. 19.73. The solid-state temperature sensor at the motherboard
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Fig. 19.74. CPUmark 99 testing results (overclocking by increasing the FSB frequency)
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Fig. 19.75. FPU WinMark testing results (overclocking by increasing the FSB frequency)
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Fig. 19.76. Intact L1 bridges at the surface of the Athlon processor case
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Fig. 19.77. CPUmark 99 testing results (overclocking via multiplier)
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Fig. 19.78. FPU WinMark testing results (overclocking via multiplier)
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Fig. 19.79. CPUmark 99 testing results (overclocking via the bus and multiplier)
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Fig. 19.80. FPU WinMark testing results (overclocking via the bus and multiplier)
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Fig. 19.81. CPUmark 99 test results
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Fig. 19.82. FPU WinMark test results
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Fig. 19.83. The AMD Duron 600 processor
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Fig. 19.84. Photo of the Soltek SL-75KV+ motherboard
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Fig. 19.85. The Abit KT7 motherboard
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Fig. 19.86. The TITAN TTC-D2T cooler
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Fig. 19.87. Flexible temperature sensor on the SL-75KV+ motherboard
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Fig. 19.88. The solid-state temperature sensor on the Abit KT7 motherboard
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Fig. 19.89. DIP switches on the SL-75KV+ motherboard (SW1 is highlighted)
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Fig. 19.90. CPUmark 99 testing results (overclocking via the bus, Abit KT7)
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Fig. 19.91. FPU WinMark testing results (overclocking via the bus, Abit KT7)
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Fig. 19.92. CPUmark 99 testing results (overclocking via the bus, SL-75KV+)
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Fig. 19.93. FPU WinMark testing results (overclocking via the bus, SL-75KV+)
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Fig. 19.94. Initial state of the L1 bridges at the surface of the AMD Duron processor
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Fig. 19.95. The restored L1 bridges at the surface of the AMD Duron processor
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Fig. 19.96. DIP switches on the SL-75KV+ motherboard (SW2 highlighted)
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Fig. 19.97. CPUmark 99 testing results (overclocking via the multiplier, Abit KT7)
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Fig. 19.98. FPU WinMark testing results (overclocking via the multiplier, Abit KT7)
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Fig. 19.99. CPUmark 99 testing results (overclocking via the multiplier, SL-75KV+)
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Fig. 19.100. FPU WinMark testing results (overclocking via the multiplier, SL-75KV+)
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Fig. 19.101. CPUmark 99 testing results (overclocking using both the bus and the multiplier, SL-75KV+)
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Fig. 19.102. FPU WinMark testing results (overclocking via the bus and the multiplier, SL-75KV+)
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Fig. 19.103. CPUmark 99 testing results (overclocking via the bus and the multiplier, Abit KT7)
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Fig. 19.104. FPU WinMark testing results (overclocking both the bus and the multiplier, Abit KT7)
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